Substrate state measurement device, plating apparatus, and substrate state measurement method

A substrate state measurement device comprising:

• a stage configured to support a substrate such that the stage is able to rotate the substrate, the substrate including a seed layer and a resist layer formed on the seed layer;
• and
• at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage,
• wherein a state of a sealing member contact area is measured on the basis of detection performed by the white confocal sensor on the sealing member contact area, the sealing member contact area being an area on the substrate which comes into contact with a sealing member.

A substrate state measurement device comprising:

• a stage configured to support a substrate such that the stage is able to rotate the substrate, the substrate including a seed layer and a resist layer formed on the seed layer;
• and
• at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage,
• wherein a state of a plated area is measured on the basis of detection performed by the white confocal sensor on the plated area on the substrate.

A substrate state measurement method comprising:

• arranging a substrate on a stage, the substrate including a seed layer and a resist layer formed on the seed layer;
• detecting a power supply member contact area by a white confocal sensor while rotating the substrate arranged on the stage, the power supply member contact area being an area on the substrate which comes into contact with a power supply member;
• and
• measuring a state of the power supply member contact area on the basis of detection performed by the white confocal sensor.

A substrate state measurement method comprising:

• arranging a substrate on a stage, the substrate including a seed layer and a resist layer formed on the seed layer;
• detecting a sealing member contact area by a white confocal sensor while rotating the substrate arranged on the stage, the sealing member contact area being an area on the substrate which comes into contact with a sealing member;
• and
• measuring a state of the sealing member contact area on the basis of detection performed by the white confocal sensor.

A substrate state measurement method comprising:

• arranging a substrate on a stage, the substrate including a seed layer and a resist layer formed on the seed layer;
• detecting a plated area on the substrate by a white confocal sensor while rotating the substrate arranged on the stage;
• and
• measuring a state of the plated area on the basis of detection performed by the white confocal sensor.