Substrate supporting unit, apparatus for treating substrate, and method of manufacturing semiconductor device

An apparatus for treating a substrate, comprising:

• a chamber;
• a substrate support unit disposed in the chamber and configured to support a substrate;
• and
• a gas injection unit disposed above the substrate support unit, and configured to inject process gas onto the substrate,
• wherein the substrate support unit includes:
• a chuck having an upper surface on which to mount a substrate, and including a heater for heating the substrate;
• a shaft supporting a lower portion of the chuck, and including an electric line connected to the heater;
• a support having an accommodation space surrounding and accommodating a portion of the shaft, and supporting the shaft;
• a seal sealing a lower portion of the accommodation space;
• an inlet communicating with the accommodation space and configured to transfer cooling gas for cooling the electric line into the accommodation space, the inlet being disposed in one of the support and the seal;
• and
• an outlet disposed in the support, communicating with the accommodation space, and configured to transfer the cooling gas out of the support.

An apparatus for treating a substrate, comprising:

• a chamber;
• a substrate support unit disposed in the chamber and configured to support a substrate;
• and
• a gas injection unit disposed above the substrate support unit and configured to inject process gas onto the substrate,
• wherein the substrate support unit includes:
• a chuck having an upper surface on which to mount a substrate, and including a heating member for heating the substrate;
• a shaft portion supporting a lower portion of the chuck, having an electric line connected to the heating member disposed thereon, and including a slip ring connecting the electric line to a power supply source;
• a support portion having an accommodation space surrounding and accommodating a portion of the shaft portion, and connected to the shaft portion to rotate the chuck;
• a seal sealing a lower portion of the accommodation space;
• an inlet communicating with the accommodation space and located to transfer cooling gas for cooling the electric line into the accommodation space, the inlet disposed in the seal;
• and
• an outlet communicating with the accommodation space and located to transfer the cooling gas from the accommodation space to an outside of the substrate support unit, the outlet connected to an opening in a rotation cylinder of the substrate support unit.