Curable resin composition
AssigneeAdeka Corporation
InventorMasato INADOME
Life of this patent
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Abstract
A curing resin composition useful as an adhesive excellent in impact resistance, heat resistance, and water resistance is provided. The composition contains (A) an epoxy resin, (B) a blocked urethane, and (C) an amine latent curing agent. The blocked urethane (B) has a weight average molecular weight Mw of 15,000 to 38,000 and a ratio of weight average molecular weight Mw to number average molecular weight Mn, Mw/Mn, of 1.9 to 3.0. The epoxy resin (A) is preferably a bisphenol epoxy resin. The blocked urethane (B) preferably contains a blocked urethane having an oxybutylene group and a blocked urethane having an oxypropylene group.
Claims5
A curing resin composition comprising (A) an epoxy resin, (B) a blocked urethane, and (C) an amine latent curing agent, wherein
- the blocked urethane (B) has Mw of 15,000 to 38,000, and Mw/Mn of 1.9 to 3.0
- wherein Mw represents a weight average molecular weight of the blocked urethane (B), and Mn represents a number average molecular weight of the blocked urethane (B).
Dependencies are inferred from the claim text.