Adhesive composition
AssigneeToyobo Co., Ltd.
InventorTakuya SHIBA
Life of this patent
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Abstract
An object of the present invention is to provide an epoxy-based adhesive having excellent toughness and heat resistance as well as excellent adhesiveness to a substrate. The adhesive composition according to the present invention can suitably be used as an adhesive excellent in adhesiveness, toughness, and heat resistance, is therefore expected to greatly contribute to industry, especially in the field of structural adhesives. An adhesive composition containing an epoxy resin (A), a curing agent (B), a curing catalyst (C), a thixotropic agent (D), and a crystalline polyester (E).
Claims16
1-7. (canceled)
An adhesive composition containing
- an epoxy resin (A),
- a curing agent (B),
- a curing catalyst (C),
- a thixotropic agent (D), and
- a crystalline polyester (E).
Dependencies are inferred from the claim text.