Resin composition and article made therefrom

Abstract

This present disclosure provides resin composition and article made therefrom, including prepreg, resin film, laminate, or printed circuit board. Resin composition comprises: (A) 100 parts by weight of unsaturated C═C double bond-containing polyphenylene ether resin; and (B) 20 parts by weight to 100 parts by weight of phosphorus-containing polyolefine resin. Phosphorus-containing polyolefine resin consists of (a) structural unit and (b) structural unit, and/or consists of (a) structural unit, (b) structural unit and (c) structural unit, wherein (a) structural unit comprises any one of (al) structural unit, (a2) structural unit, or combination thereof, and (b) structural unit comprises any one of (bi) structural unit, (b2) structural unit, or combination thereof. Article has improvement in at least one of following properties: stickiness resistance, glass transition temperature, copper foil peeling strength, dielectric properties, water absorption rate, flame retardancy, thermal resistance after moisture absorption, appearance of laminate, alkali resistance.

Dependencies are inferred from the claim text.