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US 2025/0144677 A1Published application
Method for cleaning substrate and cleaning device
AssigneeKioxia Corporation
InventorsMinako INUKAI, Hideaki SAKURAI, Kyo OTSUBO, Tetsuo TAKEMOTO
Life of this patent
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Abstract
According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.
Claims14
A method for cleaning a substrate, comprising:
- dispensing a liquid with a temperature higher than a freezing point of the liquid onto a substrate mounted on a stage and forming a liquid film on the substrate;
- cooling the liquid film on the substrate to a supercooled state;
- varying an internal pressure of the liquid on the substrate when the temperature of the liquid reaches a setpoint temperature to form a solidified body on the substrate from the liquid film by dispensing an additional liquid onto the liquid film on the substrate;
- and
- melting the solidified body on the substrate.
2 more elements
A method for cleaning a substrate, comprising:
- dispensing a liquid onto the substrate mounted on a stage;
- cooling the liquid on the substrate to a supercooled state;
- varying an internal pressure of the liquid when a temperature of the liquid reaches a setpoint temperature to form a solidified body on the substrate;
- and
- melting the solidified body on the substrate, wherein
- varying the internal pressure of the liquid includes dispensing an additional liquid onto the liquid on the substrate.
3 more elements
Dependencies are inferred from the claim text.