Hybrid power converters, lateral devices, vertical devices, multiple copper clips, replica devices

Abstract

Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaged) approach. The power converter includes a first integrated circuit die with a plurality of first switches and a plurality of second switches. The power converter further includes a second integrated circuit die including a controller circuit that is electrically coupled to control switching of the plurality of first switches and the plurality of second switches. The power converter may include additional integrated circuit dies coupled to the controller circuit. The plurality of first switches and the plurality of second switches may each include vertical double-diffused metal-oxide semiconductor field effect transistors. The plurality of first switches and the plurality of second switches may each include lateral double-diffused metal-oxide semiconductor field effect transistors.

Dependencies are inferred from the claim text.