Thermal dissipation-enhanced optical module and optical communication system including the same
AssigneeLESSENGERS Inc.
InventorsTaeyong KIM, Manjae KIM, Chongcook KIM
Life of this patent
Estimating the term…
Loading patent…
AssigneeLESSENGERS Inc.
InventorsTaeyong KIM, Manjae KIM, Chongcook KIM
Estimating the term…
Embodiments disclose an optical module and an optical communication system including the same, the optical module including a substrate, an optical component positioned on the substrate and converting an electrical signal into an optical signal or converting an optical into an electrical signal, an electronic component driving the optical component, an optical fiber support fixing an optical fiber positioned away from the optical component, an optical wire optically connecting the optical component and one end of the optical fiber, a container accommodating the optical component, the electronic component, and the optical fiber and isolated from the outside, and coolant filled in the container, wherein the electronic component, the optical component, and the optical wire contact the coolant.
An optical module comprising:
An optical communication system comprising:
Dependencies are inferred from the claim text.