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US 2025/0125246 A1Published application
Circuit board assembly having circuit board with adjacent chips immersed in dielectric liquid and method of making the same
AssigneeAuradine, Inc.
InventorsAnuya Reddy, Lyle Looney, Darshan Shah
Life of this patent
Estimating the term…
Abstract
A circuit board assembly is provided. The circuit board assembly includes a circuit board and a plurality of chips assembled on a surface of the circuit board. The plurality of chips include integrated circuit (IC) chips. At least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips. A circuit board and a method for circuit board assembly are also provided.
Claims20
A circuit board assembly comprising:
- a circuit board configured to be immersed in a dielectric liquid, the circuit board comprising:
- a plurality of integrated circuit (IC) chips assembled on a surface of the circuit board and arranged in a plurality of columns that are grouped into a plurality of arms, each arm comprising a subset of columns of the plurality of columns,
- wherein the subset of columns in each arm are electrically coupled to one another using one or more connector terminals,
- wherein each column of the plurality of columns comprises a subset of the plurality of IC chips, and
- wherein the IC chips in each subset are placed adjacent to one another without intervening metallic spacers.
2 more elements
A circuit board comprising:
- a plurality of integrated circuit (IC) chips assembled on a surface of the circuit board and arranged in a plurality of columns that are grouped into a plurality of arms, each arm comprising a subset of columns of the plurality of columns,
- wherein the subset of columns in each arm are electrically coupled to one another using one or more connector terminals,
- wherein each column of the plurality of columns comprises a subset of the plurality of IC chips, and
- wherein the IC chips in each subset are placed adjacent to one another without intervening metallic spacers.
1 more element
A method, comprising:
- arranging a plurality of integrated circuit (IC) chips in a plurality of columns on a surface of a circuit board;
- and
- grouping the plurality of columns into a plurality of arms, each arm comprising a subset of columns of the plurality of columns,
- wherein the subset of columns in each arm are electrically coupled to one another using one or more connector terminals,
- wherein each column of the plurality of columns comprises a subset of the plurality of IC chips, and
- wherein the IC chips in each subset are placed adjacent to one another without intervening metallic spacers.
3 more elements
Dependencies are inferred from the claim text.