GaN CRYSTAL AND GaN WAFER
AssigneeMitsubishi Chemical Corporation
InventorsYusuke TSUKADA, Takayuki ISHINABE, Yutaka TSUJII, Tatsuya TAKAHASHI, Hirotaka IKEDA
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AssigneeMitsubishi Chemical Corporation
InventorsYusuke TSUKADA, Takayuki ISHINABE, Yutaka TSUJII, Tatsuya TAKAHASHI, Hirotaka IKEDA
Estimating the term…
A GaN crystal with an angle between the normal line of a main surface and an m-axis of 0 degrees or more and 20 degrees or less is provided, in which the GaN crystal having, on the main surface thereof, a band-shaped dislocation-concentrated region that satisfies at least one requirement selected from the group consisting of (1) to (3) and a GaN wafer with a narrow width of the band-shaped dislocation-concentrated region present on the main surface and contribution to an improvement in the yield of a nitride semiconductor device: (1) a maximum effective width is less than 50 μm; (2) at least one of a requirement (A) or a requirement (B) is satisfied, where (A) a dislocation density (DY) for a width of 15 μm from the center is less than 3×107 cm−2, and (B) a dislocation density (DZ) for a width of 50 μm from the center is less than 2.5×107 cm−2; and (3) a ratio (DZ/DX) of DZ to DX (a dislocation density DX for a width of 5 μm from the center) is 0.5 or less, and/or DZ/DY is 0.5 or less.
A GaN crystal comprising a main surface with an angle between a normal line of the main surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein
A GaN crystal comprising a main surface with an angle between a normal line of the main surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein
A method for producing a GaN crystal, the method comprising at least:
Dependencies are inferred from the claim text.