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US 2025/0108568 A1Published application
Systems and methods for concurrent reaction-bonded joining and densification
AssigneeUchicago Argonne, LLC
InventorsDileep Singh, Wenchao Du
Life of this patent
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Abstract
A method can include providing two or more parts. The two or more parts can include a first part and a second part. The method can include disposing a source material between the first part and the second part. The method can include joining and densifying the first part and the second part by reacting a liquid with the source material.
Claims20
A method, comprising:
- providing two or more parts, the two or more parts comprising a first part and a second part;
- disposing a source material between the first part and the second part;
- and
- joining and densifying the first part and the second part by reacting a liquid with the source material.
1 more element
A system comprising:
- two or more parts comprising:
- a first part comprising silicon carbide;
- and
- a second part comprising silicon carbide, the second part coupled with the first part;
- and
- a joining layer disposed between the first part and the second part, the joining layer comprising:
- one or more layers of silicon;
- and
- one or more layers of silicon carbide.
6 more elements
Dependencies are inferred from the claim text.