Quantum device and method of manufacturing same
AssigneeNEC Corporation
InventorsKatsumi KIKUCHI, Satoshi TSUKIYAMA, Tomohiro NISHIYAMA
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Abstract
A quantum device using a quantum state, including a quantum chip, a wiring component having a wiring layer, and a laminated substrate installed so that at least the surface of the wiring component on which the quantum chip is mounted is exposed, wherein a wiring layer of the laminated substrate and the wiring layer of the wiring component are connected by an integrated conductor pattern.
Claims15
A quantum device using a quantum state, comprising:
- a quantum chip;
- a wiring component having a wiring layer;
- a laminated substrate installed so that at least the surface of the wiring component on which the quantum chip is mounted is exposed;
- and
- an integrated conductor pattern connecting the wiring layer of the laminated substrate with the wiring layer of the wiring component.
A method of manufacturing a quantum device comprising a quantum chip, a wiring component having a wiring layer, and a laminated substrate installed so that at least the surface of the wiring component on which the quantum chip is mounted is exposed, the method comprising:
- embedding the wiring component in a recess of the laminated substrate;
- and
- connecting the laminated substrate and the wiring component by an integrated conductor pattern.
Dependencies are inferred from the claim text.