Display panel, display apparatus, and method for manufacturing display panel

A display panel, comprising:

• a substrate;
• an isolation structure provided on a side of the substrate, wherein the isolation structure encloses and forms a plurality of opening structures;
• a light-emitting functional layer provided on a side of the substrate, wherein the light-emitting functional layer comprises a plurality of light-emitting units provided within the plurality of opening structures;
• and
• a first encapsulation layer provided on a side of the light-emitting functional layer away from the substrate, wherein the first encapsulation layer comprises a plurality of encapsulation portions corresponding to the light-emitting units;
• wherein etching durations corresponding to the encapsulation portions corresponding to at least a part of the light-emitting units having different light-emitting colors are different.

A method for manufacturing a display panel, comprising:

• forming an isolation structure on a side of a substrate, wherein the isolation structure encloses and forms a plurality of opening structures, and the plurality of opening structures comprise at least one first opening structure and at least one second opening structure;
• forming a first light-emitting unit and a first encapsulation material layer covering the first light-emitting unit within each of the opening structures;
• performing an etching treatment on the first light-emitting unit and the first encapsulation material layer within the second opening structure, and remaining the first light-emitting unit and the first encapsulation material layer within the first opening structure, wherein an etching duration corresponding to the first encapsulation material layer is T1;
• forming a second light-emitting unit and a second encapsulation material layer covering the second light-emitting unit within the second opening structure and on the first encapsulation material layer;
• performing an etching treatment on the second light-emitting unit and the second encapsulation material layer on the first encapsulation material layer, and remaining the second light-emitting unit and the second encapsulation material layer within the second opening structure, wherein an etching duration corresponding to the second encapsulation material layer is T2, and T1>T2.