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US 2025/0098378 A1Published application
Method for manufacturing optoelectronic structure and a package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsPei-Jung YANG, Jr-Wei LIN, Mei-Ju LU, Chi-Han CHEN
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Abstract
A method for manufacturing an optoelectronic structure and a package structure are provided. The method includes providing a substrate and a light source module and a photonic component over the substrate; and adjusting a lens structure to a unit specific position related to the substrate to couple an optical signal from the light source module to the photonic component.
Claims20
A method for manufacturing an optoelectronic structure, comprising:
- providing a substrate and a light source module and a photonic component over the substrate;
- and
- adjusting a lens structure to a unit specific position related to the substrate to couple an optical signal from the light source module to the photonic component.
A method for manufacturing an optoelectronic structure, comprising:
- providing a substrate, and a first light source module, a first photonic component, a second light source module, and a second photonic component over the substrate;
- actively aligning the first light source module with the first photonic component by moving a first lens structure to a first unit specific position related to the first photonic component;
- and
- actively aligning the second light source module with the second photonic component by moving a second lens structure to a second unit specific position related to the second photonic component.
1 more element
A package structure, comprising:
- an optoelectronic structure comprising a first optical component, a second optical component, and an optical alignment component configured to define an optical path between the first optical component and the second optical component,
- wherein the optical alignment component is disposed at a unit specific position related to the first optical component and the second optical component.
Dependencies are inferred from the claim text.