Chip package structure and method of manufacturing the same
AssigneesSamsung Electronics Co., Ltd., Samsung Semiconductor China Research & Development Co., LTD.
InventorWeizhong ZHOU
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Abstract
A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a substrate; a chip spaced from the substrate and having a first surface, a second surface and a side surface, the first surface of the chip including a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a molding layer having a first surface and a second surface, the molding layer provided on the non-photosensitive area of the chip and the side surface of the chip.
Claims13
A semiconductor chip package comprising:
- a substrate;
- a semiconductor chip provided on the substrate and spaced apart from the substrate, the semiconductor chip having a first surface facing the substrate, a second surface facing a direction opposite to the first surface, and a side surface connecting the first surface and the second surface, the first surface of the semiconductor chip comprising a first area and a second area surrounding the first area;
- a molding layer having a first surface facing the substrate and a second surface opposite to the first surface, the molding layer provided on the second area of the semiconductor chip and the side surface of the semiconductor chip;
- and
- an adhesive layer provided between the substrate and the molding layer.
13-23. (canceled)
Dependencies are inferred from the claim text.