Semiconductor device and method for manufacturing a semiconductor device

A semiconductor device comprising:

• a planar carrier having a main surface on which a semiconductor chip element is mounted, the semiconductor chip element having at least one semiconductor chip;
• at least one wire connection between the main surface of the carrier and a top surface of the at least one semiconductor chip;
• a first material completely enclosing the wire connection and comprising a first plastic material;
• and
• a second material forming a frame and surrounding a cavity,
• wherein the top surface of the at least one semiconductor chip has a region that is free of the first and second materials and is arranged in the cavity, and
• wherein the top surface of the at least one semiconductor chip has a region that is free of any material.

A semiconductor device comprising:

• a planar carrier having a main surface on which a semiconductor chip element is mounted, the semiconductor chip comprising at least one semiconductor chip;
• at least one wire connection between the main surface of the carrier and a top surface of the at least one semiconductor chip;
• a first material completely enclosing the wire connection and comprising a first plastic material;
• and
• a second material forming a frame and surrounding a cavity,
• wherein the top surface of the at least one semiconductor chip has a region that is free of the first and second materials and is arranged in the cavity,
• wherein the top surface of the semiconductor chip has a region that is free of any material,
• wherein the semiconductor chip element comprises, as the at least one semiconductor chip, an electronic semiconductor chip having the top surface on which an optoelectronic semiconductor chip is mounted, the optoelectronic semiconductor chip being spaced apart from the first and second materials in the cavity.