Anti-doped mos device and voltage reference circuit including same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Cheng Ho, Chia-Yu Wei, Po-Yu Chiang, Victor Chiang Liang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Cheng Ho, Chia-Yu Wei, Po-Yu Chiang, Victor Chiang Liang
Estimating the term…
In a method of fabricating an electronic device, a first nMOS device structure and a second nMOS device structure are formed. Each nMOS device structure includes a gate oxide disposed on a p-type base material and a gate disposed on the gate oxide. N-type dopant implantation is performed to form source and drain regions in the p-type substate of the first nMOS device structure and source and drain regions in the p-type substate of the second nMOS device structure, and to further dope the gate of the first nMOS device structure n-type to form a first nMOS device with the gate doped n-type. P-type dopant implantation is performed to dope the gate of the second nMOS device structure p-type to form the second nMOS device structure with the gate anti-doped p-type.
A method of fabricating an electronic device, the method comprising:
A method of fabricating an electronic device, the method comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.