Impurity reduction techniques in gallium nitride regrowth
AssigneeAnalog Devices, Inc.
InventorsJames G. Fiorenza, Daniel Piedra
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AssigneeAnalog Devices, Inc.
InventorsJames G. Fiorenza, Daniel Piedra
Estimating the term…
Various techniques for impurity dopant reduction in GaN regrowth are described. In a first technique, a barrier layer, such as AlN, can be formed at a regrowth interface before the regrown GaN layer. The barrier layer can bury the impurities at the regrowth interface and reduce their effect on the layers above that include the channel of the device, e.g., transistor. In a second technique, a buffer layer, such as a carbon-doped GaN layer, can be formed at the regrowth interface before the regrown GaN layer. Carbon can act as an acceptor to compensate for the dopants. e.g., silicon, and cancel their electronic effect on the above layers. In a third technique, a hydrogen bake treatment can be performed before the GaN regrowth. Hydrogen can desorb a thin layer of GaN at the regrowth interface, which is the GaN layer with the highest concentration of impurities.
A method of forming a semiconductor device to reduce or counteract impurities at a regrowth interface, the method comprising:
A semiconductor assembly comprising:
A semiconductor assembly comprising:
Dependencies are inferred from the claim text.