US 2025/0098185 A1 · Electronic Device with Three-Dimensional On-Chip Inductors

Abstract

An electronic device may include wireless circuitry. The wireless circuitry may include inductors. The inductors may include an on-chip three-dimensional (3D) inductor. The 3D inductor may include a stack of windings in different metallization layers of the substrate. The 3D inductor may include at least one additional winding formed from at least one of the same metallization layers as the stack of windings. The at least one additional winding may laterally surround at least one of the windings from the stack of windings. The stack of windings may be vertically aligned or staggered. The at least one additional winding may be arranged in a vertically aligned stack or a staggered stack. Two or more stacks of windings may be separated by a winding between the stacks. The inductor may occupy a minimal amount of area while minimizing fringing capacitance, thereby optimizing quality factor and self-resonance frequency.

Claims20

Dependent claims

An integrated circuit comprising:

a semiconductor substrate having a first metallization layer, a second metallization layer, and a third metallization layer;
and
an inductor that includes
a first winding formed from the first metallization layer,
a second winding that is formed from the second metallization layer and that at least partially overlaps the first winding,
a third winding that is formed from the third metallization layer and that at least partially overlaps the second winding, and
a fourth winding that is formed from the third metallization layer and that laterally surrounds the third winding.

4 more elements

Wireless circuitry comprising:

a substrate having a first metallization layer, a second metallization layer, and a third metallization layer;
and
an inductor embedded in the substrate, the inductor including
a first winding in the first metallization layer,
a second winding in the second metallization layer,
a third winding in the third metallization layer,
a fourth winding in the third metallization layer that extends around the third winding,
a fifth winding in the second metallization layer that extends around the second winding, and
a sixth winding in the first metallization layer that extends around the first winding, wherein the inductor is configured to pass current from the first winding to the second winding, from the second winding to the third winding, from the third winding to the fourth winding, from the fourth winding to the fifth winding, and from the fifth winding to the sixth winding.

6 more elements

Dependencies are inferred from the claim text.

Electronic Device with Three-Dimensional On-Chip Inductors

Life of this patent

Electronic Device with Three-Dimensional On-Chip Inductors

Life of this patent

Abstract

Claims20