Heat dissipation structure, vehicle-mounted device, and terminal device

A vehicle-mounted device, comprising a heat dissipation structure, wherein the heat dissipation structure comprises:

• a heat sink;
• a circuit board comprising at least one chip mounting region and at least one first position located outside the chip mounting region;
• at least one chip disposed in at least one chip mounting region on the circuit board;
• at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink;
• and
• at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.

A terminal device, comprising a heat dissipation structure, wherein the heat dissipation structure comprises:

• a heat sink;
• a circuit board comprising at least one chip mounting region and at least one first position located outside the chip mounting region;
• at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink;
• and
• at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.