Non-Condensing Thermal Materials With Low Sulfur Content

Abstract

The present disclosure relates to non-condensing thermal materials (e.g., thermal interface materials (TIMs), thermally-conductive pads, thermally-conductive EMI absorbers, etc.) with low sulfur content. In exemplary embodiments, a thermal interface material has a thermal conductivity of at least 4.5 Watts per meter per Kelvin (W/mK). The thermal interface material includes less than 50 parts per million (PPM) sulfur. And the thermal interface material is configured to be non-condensing. The thermal interface material may comprise a thermally-conductive EMI absorber; and/or the thermal interface material may be silicone free and/or have no detectable silicone.

Dependencies are inferred from the claim text.