Conductor cooling structure

Abstract

A conductor cooling structure includes a cooling plate formed into a band plate shape made of a conductive metal and being a flat plate like member configured to cool a conductor member with a predetermined electric/electronic component being fixed to a front surface of the cooling plate in such a state that the conductor member is placed on the front surface of the cooling plate, the conductor member configured to be energized with one end side of the conductor member being connected to a component terminal of the electric/electronic component, and the other end side of the conductor member being connected to an electrical connection target of the electric/electronic component, a conductor groove being formed on the front surface of the cooling plate, the conductor groove extending along a shape of a longitudinal direction of the conductor member and formed to have a sufficient depth to accommodate at least a portion of the conductor member in a thickness direction thereof, and a heat transfer member covering an area larger than at least the conductor groove on the front surface of the cooling plate so as to be sandwiched between a groove inner surface of the conductor groove and the conductor member, the heat transfer member being made of an insulating material that transfers heat of the conductor member to the cooling plate.

Dependencies are inferred from the claim text.