Thermally conductive board
AssigneeTclad Technology Corporation
InventorsKAI-WEI LO, Cheng Yi Lin, KUAN-YU CHEN
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Abstract
A thermally conductive board includes a top metal layer, a bottom metal layer, and an electrically insulating but thermally conductive layer (for simplification hereinafter referred to as “thermally conductive layer”) laminated between the top metal layer and the bottom metal layer. The thermally conductive layer includes a polymer matrix and a thermally conductive filler dispersed in the polymer matrix. The polymer matrix includes an epoxy-based composition consisting of epoxy and chlorine-containing impurities. The chlorine content of the thermally conductive layer is lower than 300 ppm.
Claims14
A thermally conductive board, comprising:
- a top metal layer;
- a bottom metal layer;
- and
- an electrically insulating but thermally conductive layer laminated between the top metal layer and the bottom metal layer, and comprising a polymer matrix and a thermally conductive filler dispersed in the polymer matrix, wherein:
- the polymer matrix comprises an epoxy-based composition consisting of epoxy and chlorine-containing impurities, wherein the epoxy is the main product obtained by a synthesis process using epichlorohydrin and a dihydric phenol as raw materials, and the chlorine-containing impurities are the unreacted epichlorohydrin and by-products produced from the synthesis process;
- and
- the chlorine-containing impurities has a chlorine content less than 300 ppm.
Dependencies are inferred from the claim text.