Back to results
US 2025/0098076 A1Published application
Board and electronic device
AssigneeKabushiki Kaisha Toshiba
InventorKakeru YAMAGUCHI
Life of this patent
Estimating the term…
Abstract
According to an embodiment, a board includes a base material, a wiring pattern, an insulating member, and a covering portion. The wiring pattern is provided on the base material. The insulating member covers the base material and the wiring pattern, and has an opening corresponding to a bump forming portion of the wiring pattern. The covering portion is formed of a material having a solder contact angle larger than that of the bump forming portion in the opening, and covers a part of the bump forming portion.
Claims7
A board comprising:
- a base material;
- a wiring pattern provided on the base material;
- an insulating member covering the base material and the wiring pattern, and having an opening corresponding to a bump forming portion of the wiring pattern;
- and
- a covering portion formed of a material having a solder contact angle larger than that of the bump forming portion in the opening, and covering a part of the bump forming portion.
2 more elements
Dependencies are inferred from the claim text.