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US 2025/0098071 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJung Hyun CHO, Jin Won LEE, Byung Kuk KANG, Chang Soo WOO
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Abstract
A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.
Claims14
A printed circuit board comprising:
- a core substrate including a plurality of core layers;
- a plurality of magnetic members embedded in each of the plurality of core layers;
- a first coil pattern disposed on the core substrate;
- and
- a second coil pattern disposed below the core substrate,
- wherein the first and second coil patterns include a plurality of first and second connection parts spaced apart from each other, respectively, and a plurality of connection vias connecting the plurality of first and second connection parts to each other;
- and
- the plurality of connection vias are disposed to surround the plurality of magnetic members on at least one side thereof.
5 more elements
Dependencies are inferred from the claim text.