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US 2025/0098067 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChi Hyeon JEONG, Jin Uk LEE, Hyun Sang KWAK, Seok Hwan KIM
Life of this patent
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Abstract
The present disclosure relates to a printed circuit board including: an insulating layer; a through-hole penetrating between an upper surface and a lower surface of the insulating layer opposing in a thickness direction; a metal wiring disposed inside the through-hole; and a metal via filling the through-hole and covering the metal wire.
Claims20
A printed circuit board comprising:
- an insulating layer;
- a through-hole penetrating between an upper surface and a lower surface of the insulating layer opposing in a thickness direction;
- a metal wire disposed inside the through-hole;
- and
- a metal via filling the through-hole and covering the metal wire.
2 more elements
A printed circuit board comprising:
- an insulating layer having a through-hole;
- a metal wire disposed inside the through-hole;
- a first metal layer filling the through-hole and covering the metal wire;
- a first seed metal layer disposed on an upper surface of each of the insulating layer and the first metal layer;
- a second seed metal layer disposed on a lower surface of each of the insulating layer and the first metal layer;
- a second metal layer disposed on an upper surface of the first seed metal layer;
- and
- a third metal layer disposed on a lower surface of the second seed metal layer.
5 more elements
A printed circuit board comprising:
- an insulating layer;
- a through-hole penetrating between an upper surface and a lower surface of the insulating layer opposing in a thickness direction;
- a first metal portion disposed inside the through-hole;
- and
- a second metal portion filling the through-hole and covering the first metal portion,
- wherein a thickness of the first metal portion in the thickness direction is larger than a width of the first metal portion in a width direction perpendicular to the thickness direction.
3 more elements
Dependencies are inferred from the claim text.