Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitry

A tamper-detect assembly comprising:

• a laminate carrier with embedded tamper-detect circuitry within the laminate carrier;
• one or more electronic components on the laminate carrier;
• and
• a heat sink cover with tamper-detect circuitry integrated within the heat sink cover, the heat sink cover being mounted to the laminate carrier and enclosing the one or more electronic components between the laminate carrier and the heat sink cover, wherein together the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components, and wherein the heat sink cover comprises:
• a heat sink;
• a thermally conductive base;
• and
• wherein the integrated tamper-detect circuitry of the heat sink cover is disposed, at least in part, between and direct-bonded to the heat sink and to the thermally conductive base of the heat sink cover.

A method of fabricating a tamper-detect assembly, the method comprising:

• forming a laminate carrier with embedded tamper-detect circuitry within the laminate carrier;
• providing one or more electronic components on the laminate carrier;
• providing a heat sink cover comprising a heat sink and a tamper-detect circuitry integrated within the heat sink cover;
• and
• mounting the heat sink cover to the laminate carrier to enclose the one or more electronic components between the laminate carrier and the heat sink cover, wherein together the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components.