Induction heating apparatus having multilayer circuit boards on which heating coils are printed
AssigneeSamsung Electronics Co., Ltd.
InventorsYounghoon WOO, Kyounghwan KIM, Kyunghoon JUNG, Jonghun HA
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Abstract
An induction heating apparatus with patterned heating coils includes a heating coil board including a vessel sensing coil configured to detect a cooking vessel, a plurality of heating coil pattern layers in which heating coils are printed and patterned, and at least two pre-impregnated material (prepreg) insulation layers positioned between two adjacent heating coil pattern layers to insulate and bond the plurality of heating coil pattern layers.
Claims20
An induction heating apparatus comprising:
- a vessel sensing coil configured to detect a cooking vessel;
- and
- a heating coil board comprising heating coils to heat the cooking vessel, wherein the heating coil board comprising:
- a plurality of heating coil pattern layers in which the heating coils are printed and patterned;
- and
- a plurality of insulating layers for insulation between the plurality of heating coil pattern layers, and
- each of the plurality of insulating layers comprises at least two pre-impregnated material (prepreg) insulation layers.
A method of producing a heating coil board for an induction heating apparatus, the method comprising:
- forming a laminated board including:
- a vessel sensing coil layer having a patterned vessel sensing coil;
- a plurality of heating coil pattern layers in which heating coils are printed and patterned;
- and
- an insulating layer positioned between two adjacent heating coil pattern layers among the plurality of heating coil pattern layers to insulate and bond the plurality of heating coil pattern layers;
- and
- producing the heating coil board by hot-pressing the laminated board,
- wherein the insulating layer is formed by overlapping a plurality of insulating layers.
Dependencies are inferred from the claim text.