Earphones

An earphone comprising:

• two speaker assemblies;
• a connection member configured to connect the two speaker assemblies, wherein the connection member provides, through a bending deformation, a clamping force for placing the two speaker assemblies on a head of a user, and the connection member includes a housing with an accommodation cavity, wherein
• a bending sensor is disposed in the accommodation cavity, and the bending sensor is configured to generate a bending signal based on a bending state of the connection member;
• and
• a processing circuit configured to determine a placement state of the earphone based on the bending signal, wherein the placement state includes one of a normal wearing state, an abnormal wearing state, or a free placement state, wherein at least one of the two ear hook assemblies includes an earphone compartment, and the earphone further includes:
• a contact sensor disposed within the earphone compartment and configured to identify whether the earphone compartment is in contact with the user, and
• the processing circuit is further configured to determine the placement state of the earphone based on the bending signal of the bending sensor and a contact signal of the contact sensor.