Semiconductor device structure and method of manufacturing the same
AssigneeInnoscience (Suzhou) Semiconductor Co., Ltd.
InventorsChang CHEN, Xiaoming LIU, Xinyu LI
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AssigneeInnoscience (Suzhou) Semiconductor Co., Ltd.
InventorsChang CHEN, Xiaoming LIU, Xinyu LI
Estimating the term…
Semiconductor device structures and methods for manufacturing the same are provided. The semiconductor device structure includes a substrate, a first nitride semiconductor layer, a second nitride semiconductor layer, a first transistor and a clamping device. The first nitride semiconductor layer is disposed on the substrate. The second nitride semiconductor layer is disposed on the first nitride semiconductor layer. The first transistor is disposed on the second nitride semiconductor layer. The first transistor includes a first control electrode, a first current electrode and a second current electrode. The clamping device is disposed on the second nitride semiconductor layer and electrically coupled with the first transistor. The clamping device includes a second transistor and a third transistor electrically coupled with the second transistor. The clamping device is electrically coupled with the first current electrode and the second current electrode of the first transistor.
A semiconductor device structure, comprising:
A method of manufacturing a semiconductor device structure, comprising:
A semiconductor device structure, comprising:
Dependencies are inferred from the claim text.