Ceramic package high bandwidth rf feedthrough

Abstract

Consistent with an aspect of the present disclosure, a package is provided that has a wall, the wall having a first surface and a second surface opposite the first surface. A plurality of conductors is also provided. First portions of each of the plurality of conductors extend in a direction away from the first surface, the first portions of each of the plurality of conductor constituting a first waveguide having a first waveguide structure. In addition, second portions of each of the plurality of conductors are embedded in the wall, the second portions of each of the plurality of conductors constituting a second waveguide having a second waveguide structure. Further, third portions of each of the plurality of conductors constitute a third waveguide having the first waveguide structure. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

Dependencies are inferred from the claim text.