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AssigneeTDK Corporation
InventorsMingyu CHEN, Makoto ENDO, Yoshihiro KANBAYASHI, Takasi SATOU, Natsumi KOZAI, Yoshihiko TANABE, Syuji TSUKAMOTO, Miyuki YANAGIDA
Estimating the term…
A current collector including: a resin layer having first and second surfaces on opposites sides; and a metal layer including copper. The metal layer includes a first metal layer located on a side of the first surface of the resin layer. A yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer. The yield stress σY1 [MPa] is obtained by expressions (1) and (2) from a resin layer yield stress σY2 [MPa], a resin layer thickness D2 [μm], a yield stress σY3 [MPa] of the metal layer, and a thickness D3 [μm] of the metal layer: σ Y 1 = A × σ Y 3 + ( 1 - A ) × σ Y 2 ( 1 ) A = D 3 / ( D 2 + D 3 ) . ( 2 ) The yield stress σY3 [MPa] is obtained by the following expression (3) from a half-value width β [°] of an X-ray diffraction peak having the highest intensity in an X-ray diffraction pattern of the metal layer σ Y 3 = ( - 103 + 1 6 44 × √ β ) . ( 3 )
A current collector comprising:
A method for manufacturing a current collector that has a laminated structure that includes a resin layer and a metal layer including copper, the method comprising a step of designing a yield stress and a thickness of each of layers constituting the laminated structure such that a yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer.
Dependencies are inferred from the claim text.