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AssigneeTDK Corporation
InventorsMingyu CHEN, Makoto ENDO, Keisuke TATSUZAKI, Shun IKENARI, Kosuke TANAKA
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A current collector including: a resin layer having first and second surfaces; and a metal layer including aluminum. The metal layer includes a first metal layer located on a side of the first surface of the resin layer. A yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer. The current collector yield stress σY1 [MPa] is obtained by the following expressions (1) and (2) from a yield stress σY2 [MPa] of the resin layer, a resin layer thickness D2 [μm], a yield stress σY3 [MPa] of the metal layer, and a metal layer thickness D3 [μm]. σY1=A×σY3+(1−A)×σY2 (1) A=D3/(D2+D3) (2) The metal layer yield stress σY3 [MPa] is obtained by the following expression (3) from a half-value width β [°] of an X-ray diffraction peak having the highest intensity in an X-ray diffraction pattern of the metal layer. σY3=(−259+1285×√β) (3)
A current collector comprising:
A method for manufacturing a current collector that has a laminated structure that includes a resin layer and a metal layer including aluminum, the method comprising a step of designing a yield stress and a thickness of each of layers constituting the laminated structure such that a yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer.
Dependencies are inferred from the claim text.