Semiconductor package structure and packaging method thereof

A packaging method, comprising:

• providing a substrate, including first conductive pads and packaging pads locating on opposite sides of the substrate;
• attaching one or more semiconductor chips onto the substrate;
• forming first metal wires to connect the semiconductor chips to the packaging pads;
• forming a second metal wire to connect with a chip-contact pad of a semiconductor chip of the semiconductor chips;
• forming a molding compound on a surface of the substrate to encapsulate the semiconductor chips and the first metal wires, wherein one end of the second metal wire connects to the chip-contact pad, and another end of the second metal wire is exposed at a surface of the molding compound;
• and
• forming a first metal pad on a side of the molding compound to connect with the second metal wire.

A packaging method, comprising:

• providing a substrate, including first conductive pads;
• attaching one or more semiconductor chips on a side of the substrate away from the first conductive pads;
• forming a first metal wire to connect with the substrate and a chip-contact pad of the one or more semiconductor chips;
• forming a second metal wire to connect with a chip-contact pad of the one or more semiconductor chips;
• forming a molding compound on a surface of the substrate to encapsulate the one or more semiconductor chips;
• and
• forming a redistribution layer on the molding compound,
• wherein the redistribution layer comprises a second conductive pad exposed at a surface of the redistribution layer, and the second metal wire connects the redistribution layer with a chip contact pad of the one or more semiconductor chips.