Inductive Heatable Particles in Semiconductor Module
AssigneeInfineon Technologies AG
InventorsFabian Jaeger, Jens Krugmann
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Abstract
A method of producing a semiconductor module includes providing a power module assembly that includes a floor section, a housing that encloses an interior volume over the floor section, and a power semiconductor die mounted to a power electronics carrier within the interior volume, filling the interior volume with a potting compound, providing inductive heatable particles within the power module assembly, and inductively heating the inductive heatable particles to activate and/or accelerate a chemical reaction in the potting compound.
Claims20
A method of producing a semiconductor module, the method comprising:
- providing a power module assembly that comprises a floor section, a housing that encloses an interior volume over the floor section, and a power semiconductor die mounted to a power electronics carrier within the interior volume;
- filling the interior volume with a potting compound;
- providing inductive heatable particles within the power module assembly;
- and
- inductively heating the inductive heatable particles to activate and/or accelerate a chemical reaction in the semiconductor module.
A semiconductor module, comprising:
- a floor section;
- a housing that encloses an interior volume over the floor section;
- a power semiconductor die mounted to a power electronics carrier within the interior volume;
- a potting compound within the interior volume;
- and
- inductive heatable particles,
- wherein the inductive heatable particles are either within the potting compound or are within a structure that is thermally coupled to the potting compound.
Dependencies are inferred from the claim text.