Power supply module with high heat dissipation capability and high reliability, and integrated module

A power supply module with high heat dissipation capability and high reliability, wherein the power supply module is characterized by comprising a switch assembly layer, a magnetic assembly layer, a first connecting layer and a metal interconnection layer;

• the first connecting layer is arranged between the switch assembly layer and the magnetic assembly layer, the first connecting layer is used for fixedly connecting the switch assembly layer with the magnetic assembly layer, and the first connecting layer is made of an insulating material;
• the switch assembly layer, the first connecting layer and the magnetic assembly layer are integrally formed through pressing to form an assembly body;
• the metal interconnection layer is arranged on a surface of the assembly body, the metal interconnection layer is provided with a plurality of different electrical properties, and the metal interconnection layer wraps at least a part of a top surface of the assembly body, at least a part of a side surface of the assembly body and at least a part of a bottom surface of the assembly body;
• the switch assembly layer is electrically connected to the magnetic assembly layer by means of the metal interconnection layer.