Power module with stacked structure

A power module, comprising:

• an inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, wherein the inductor assembly comprises a magnetic core, a first winding and a second winding at least partially embedded within the magnetic core, and wherein each of the first winding and the second winding has a first end and a second end exposed at the second surface of the inductor assembly;
• and
• a device substrate having a first surface and a second surface opposite to the first surface of the device substrate, the device substrate comprising:
• a first power device chip and a second power device chip at least partially embedded within the device substrate, wherein each of the first power device chip and the second power device chip has a first switch, a second switch and a switching pin electrically connected to a common node of the first switch and the second switch;
• a first top heat layer at least partially covering the first power device chip;
• a second top heat layer at least partially covering the second power device chip;
• a first connecting pillar electrically connected to the switching pin of the first power device chip;
• and
• a second connecting pillar electrically connected to the switching pin of the second power device chip;
• wherein
• the first end of the first winding is electrically connected to the first top heat layer and the first connecting pillar, and the first end of the second winding is electrically connected to the second top heat layer and the second connecting pillar.

A power module, comprising:

• an inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, wherein the inductor assembly comprises a magnetic core, a first winding and a second winding at least partially embedded within the magnetic core, each of the first winding and the second winding having a first end and a second end exposed at the second surface of the inductor assembly;
• and
• a device substrate having a first surface and a second surface opposite to the first surface of the device substrate, the device substrate comprising:
• a first power device chip and a second power device chip at least partially embedded within the device substrate;
• a first top heat layer at least partially covering the first power device chip;
• and
• a second top heat layer at least partially covering the second power device chip;
• wherein
• the first end of the first winding is electrically connected to the first top heat layer, and the first end of the second winding is electrically connected to the second top heat layer.