Manufacturing method of semiconductor package

A manufacturing method of a semiconductor package, comprising:

• providing a lower semiconductor device;
• disposing a dummy die at a first side of the lower semiconductor device;
• forming a plurality of conductive pillars on the lower semiconductor device, wherein the plurality of conductive pillars are arranged along a second side of the lower semiconductor device;
• disposing an upper semiconductor device on the lower semiconductor device and the dummy die;
• encapsulating the lower semiconductor device, the dummy die, the upper semiconductor device, and the plurality of conductive pillars by an encapsulating material, wherein a top surface of the encapsulating material is substantially coplanar with top surfaces of the plurality of conductive pillars and a plurality of electrical connectors of the upper semiconductor device;
• and
• forming a redistribution structure over the upper semiconductor device and the plurality of conductive pillars.

A manufacturing method of a semiconductor package, comprising:

• providing a lower semiconductor device and a dummy die in a side by side manner;
• encapsulating the lower semiconductor device and the dummy die by a first encapsulating material;
• forming a dielectric layer over the lower semiconductor device, the dummy die and the first encapsulating material;
• forming a plurality of conductive pillars extending through the dielectric layer and connecting the lower semiconductor device;
• disposing an upper semiconductor device at a side of the plurality of conductive pillars, wherein the upper semiconductor device overlap with the lower semiconductor device and the dummy die from a top view;
• encapsulating the upper semiconductor and the plurality of conductive pillars by a second encapsulating material;
• and
• forming a redistribution structure over the upper semiconductor device, the plurality of conductive pillars, and the second encapsulating material.