Integrated circuit packages and methods of forming the same

An integrated circuit package, comprising:

• a first redistribution structure and a second redistribution structure;
• a semiconductor layer between the first redistribution structure and the second redistribution structure;
• and
• at least one conductive pillar, wherein the at least one conductive pillar is partially disposed on and partially disposed in the semiconductor layer, and the at least one conductive pillar is electrically connected to the first redistribution structure and the second redistribution structure.

A method of manufacturing an integrated circuit package, comprising:

• providing a package structure, comprising a first redistribution structure;
• forming at least one conductive pillar and at least one first die on the first redistribution structure;
• forming a first encapsulant to encapsulate the at least one conductive pillar and the at least one first die, wherein the at least one first die comprises a plurality of first connectors;
• and forming a second encapsulant between the first connectors.