Microelectronic assemblies

A microelectronic assembly, comprising:

• a package substrate having an uppermost surface;
• a first die entirely above the uppermost surface of the package substrate, the first die coupled to the package substrate, the first die having a first sidewall and a second sidewall, the second sidewall laterally opposite the first sidewall;
• a second die entirely above the uppermost surface of the package substrate, the second die coupled to the package substrate, the second die having a first sidewall and a second sidewall, the second sidewall laterally opposite the first sidewall, wherein the second die is laterally spaced apart from the first die;
• an interconnect entirely above the uppermost surface of the package substrate, the interconnect laterally between the second sidewall of the first die and the first sidewall of the second die, the interconnect coupled to the package substrate, and the interconnect extending the entire vertical length of the first die;
• and
• a third die vertically over the interconnect, a portion of the first die, and a portion of the second die, the third die coupled to the interconnect and to the portion of the first die and to the portion of the second die.