Methods of bonding semiconductor elements to substrates
AssigneeKulicke and Soffa Industries, Inc.
InventorsAdeel Ahmad Bajwa, Thomas J. Colosimo, JR.
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Abstract
A method of bonding a semiconductor element to a substrate is provided. The method includes the steps of: (a) providing the semiconductor element at a position separated from the substrate, the semiconductor element including a plurality of conductive structures, each of the conductive structures including a contact portion; (b) heating the semiconductor element at the position such that the contact portions are in a molten state; and (c) bonding the semiconductor element to the substrate such that each of the contact portions is bonded to a corresponding conductive structure of the substrate.
Claims44
A method of bonding a semiconductor element to a substrate, the method comprising the steps of:
- (a) providing the semiconductor element at a position separated from the substrate, the semiconductor element including a plurality of conductive structures, each of the conductive structures including a contact portion;
- (b) heating the semiconductor element at the position such that the contact portions are in a molten state;
- and
- (c) bonding the semiconductor element to the substrate such that each of the contact portions is bonded to a corresponding conductive structure of the substrate.
A method of bonding a semiconductor element to a substrate, the method comprising the steps of:
- (a) providing the semiconductor element at a position separated from the substrate, the semiconductor element including a plurality of conductive structures, each of the conductive structures including a contact portion;
- (b) heating the semiconductor element at the position such that the contact portions are at a temperature within 40° C. of a melting point of a material of the contact portions, the temperature being below the melting point;
- and
- (c) bonding the semiconductor element to the substrate such that each of the contact portions is bonded to a corresponding conductive structure of the substrate.
A method of bonding a semiconductor element to a substrate, the method comprising the steps of:
- (a) providing the semiconductor element at a position separated from the substrate, the semiconductor element including a plurality of conductive structures;
- (b) heating the semiconductor element at the position to an increased temperature;
- (c) cooling the semiconductor element after step (b) to a reduced temperature below the increased temperature;
- and
- (d) bonding the semiconductor element to the substrate such that each of the conductive structures is bonded to a corresponding conductive structure of the substrate.
A method of bonding a semiconductor element to a substrate, the method comprising the steps of:
- (a) providing the semiconductor element at a position separated from the substrate, the semiconductor element including a plurality of conductive structures, each of the conductive structures including a contact portion;
- (b) providing a deoxidizing agent in contact with the contact portions;
- (c) heating the semiconductor element at the position such that the contact portions are in a molten state;
- (d) cooling the semiconductor element after step (c) such that the contact portions are in a solid state;
- and
- (e) bonding the semiconductor element to the substrate after step (d) such that each of the contact portions is bonded to a corresponding conductive structure of the substrate.
Dependencies are inferred from the claim text.