Package structure and fabricating method thereof

A method of fabricating a package structure, comprising:

• providing a first electronic element having a plurality of first electrode pads and a second electronic element having a plurality of second electrode pads;
• forming a positioning layer on the first electronic element, and forming a plurality of conductive bumps on the plurality of second electrode pads of the second electronic element, wherein the positioning layer has a plurality of positioning holes exposing the plurality of first electrode pads;
• inserting the plurality of conductive bumps into the plurality of positioning holes, so that the second electronic element is bonded onto the positioning layer, wherein the plurality of conductive bumps are free from being in contact with the plurality of first electrode pads in the plurality of positioning holes;
• and
• heating the plurality of conductive bumps, so that each of the plurality of conductive bumps is in contact with each of the plurality of first electrode pads, wherein the second electronic element is electrically connected to the first electronic element via the plurality of conductive bumps.