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US 2025/0096188 A1Published application
Die Bonding Apparatus, Mounting Method, and Method for Manufacturing Semiconductor Device
AssigneeFasford Technology Co., Ltd.
InventorKeita YAMAMOTO
Life of this patent
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Abstract
An object of the disclosure is to provide a technique that enables surface activated bonding between a die and a substrate, and, a die bonding apparatus includes: a first bonding head that picks up a die; a first bonding stage that holds a substrate; and a plasma irradiator that irradiates, with plasma, the surface of the die picked up by the first bonding head and the surface of the substrate held by the first bonding stage.
Claims11
A die bonding apparatus, comprising:
- a first bonding head to pick up a die;
- a first bonding stage to hold a substrate;
- and
- a plasma irradiator that irradiates with plasma a surface of the die picked up by the first bonding head and a surface of the substrate held by the first bonding stage.
1 more element
A mounting method, comprising the steps of:
- picking up a workpiece;
- holding a substrate;
- irradiating with plasma a surface of the picked-up workpiece and a surface of the held substrate;
- and
- bonding the workpiece irradiated with plasma to the substrate irradiated with plasma.
2 more elements
Dependencies are inferred from the claim text.