Chip bonding film, method of manufacturing the same, and semiconductor package including the chip bonding film

A chip bonding film comprising:

• a base film;
• a pressure-sensitive adhesive (PSA) film on the base film;
• an adhesive film on the PSA film;
• and
• a release film on the adhesive film,
• wherein the adhesive film comprises:
• an adhesive film layer that is curable by heat;
• and
• fillers that are thermally conductive and are in the adhesive film layer, each of the fillers comprising magnetic particles,
• wherein each of the fillers has a plate shape extending in a vertical direction that is perpendicular to a lower surface of the adhesive film layer, and
• wherein the fillers are connected to each other in the vertical direction from the lower surface of the adhesive film layer to an upper surface of the adhesive film layer.

A semiconductor package comprising:

• a package substrate;
• at least one chip on the package substrate;
• and
• at least one chip bonding film that bonds and fixes the at least one chip onto the package substrate,
• wherein each of the at least one chip bonding film comprises:
• an adhesive film layer that is curable by heat;
• and
• fillers that are thermally conductive and are contained in the adhesive film layer, each of the fillers comprising magnetic particles, and
• wherein a heat dissipation path is formed by the fillers in a vertical direction from a lower surface of the adhesive film layer to an upper surface of the adhesive film layer.