Microelectronic package with solder array thermal interface material (sa-tim)

A microelectronic package, comprising:

• a die coupled with a package substrate;
• solder thermal interface material (STIM) interconnects coupled with the die, wherein the STIM interconnects are at least partially surrounded by an underfill material;
• a heat spreader coupled with the STIM interconnects, wherein the die is between the heat spreader and the package substrate;
• and
• a spacer physically coupled with the heat spreader and the package substrate, wherein the spacer includes one or more of steel, copper, aluminum, or polymer.

A microelectronic package, comprising:

• a die coupled with a package substrate;
• solder thermal interface material (STIM) interconnects coupled with the die, wherein the STIM interconnects are at least partially surrounded by an underfill material;
• a heat spreader coupled with the STIM interconnects, wherein the die is between the heat spreader and the package substrate;
• a first spacer physically coupled with the heat spreader and the package substrate;
• and
• a second spacer physically coupled with the heat spreader and the package substrate.