Packaging structure and packaging method

Abstract

A packaging structure includes an intermediary board including opposed a first bonding surface and a second bonding surface, one or more device chips bonded on the first bonding surface of the intermediary board, and an interconnection chip bonded on the second bonding surface of the intermediary board. The intermediary board includes a plurality of interconnection unit areas, and the adjacent interconnection unit areas are spaced apart from each other. An interconnection structure is formed within the interconnection unit area. The device chips are electrically connected to the interconnection structures. The interconnection chip is disposed on the intermediary board between the adjacent interconnection unit areas and electrically connected to the interconnection structures of the adjacent interconnection unit areas.

Dependencies are inferred from the claim text.