Sheet for forming first protective membrane, method for manufacturing semiconductor device, and use of sheet
AssigneeLintec Corporation
InventorsTomotaka MORISHITA, Keisuke SHINOMIYA
Life of this patent
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Abstract
A first protective membrane forming sheet for forming a first protective membrane on at least a surface of a semiconductor wafer having a bump, the first protective membrane forming sheet including a first base material, a buffer layer, an intermediate release layer, and a first protective membrane forming film stacked in this order in a thickness direction thereof, wherein the intermediate release layer contains an ethylene-vinyl acetate copolymer.
Claims6
A first protective membrane forming sheet for forming a first protective membrane on at least a surface of a semiconductor wafer having a bump,
- the first protective membrane forming sheet comprising a first base material, a buffer layer, an intermediate release layer, and a first protective membrane forming film stacked in this order in a thickness direction thereof,
- wherein the intermediate release layer contains an ethylene-vinyl acetate copolymer.
A use of a sheet for forming a first protective membrane on at least a surface of a semiconductor wafer, the surface having a bump,
- the sheet comprising a first base material, a buffer layer, an intermediate release layer, and a first protective membrane forming film stacked in this order in a thickness direction of thereof,
- wherein the intermediate release layer contains an ethylene-vinyl acetate copolymer.
Dependencies are inferred from the claim text.