Semiconductor package

A semiconductor package comprising:

• a package substrate having a tetragonal shape;
• a package body disposed on an upper surface of the package substrate;
• a stiffener disposed at sides of the package substrate;
• and
• an external connection terminal disposed on a lower surface of the package substrate,
• wherein a first side and a third side of the package substrate are opposite to each other and extend in a first direction parallel to the upper surface of the package substrate,
• a second side and a fourth side of the package substrate are opposite to each other and extend in a second direction perpendicular to the first direction and parallel to the upper surface of the package substrate,
• the stiffener comprises a horizontal part disposed on the upper surface of the package substrate at the sides of the package substrate and a plurality of vertical parts extending downward from the horizontal part in a vertical direction perpendicular to the upper surface of the package substrate at corners of the package substrate formed by the first side, the second side, the third side, and the fourth side, and
• the plurality of vertical parts protrude from the lower surface of the package substrate in the vertical direction and a protrusion length of the plurality of vertical parts has a range of about 39% to about 43% of a height of the external connection terminal with respect to the lower surface of the package substrate.

A semiconductor package comprising:

• an external board;
• a package substrate disposed on the external board and having a tetragonal shape including four sides;
• a package body disposed at a center portion of an upper surface of the package substrate;
• a stiffener disposed at each of the four sides of the package substrate;
• and
• an external connection terminal disposed between a lower surface of the package substrate and the external board,
• wherein a first side and a third side of the four sides of the package substrate are opposite to each other and extend in a first direction parallel to the upper surface of the package substrate,
• a second side and a fourth side of the four sides of the package substrate are opposite to each other and extend in a second direction perpendicular to the first direction and parallel to the upper surface of the package substrate,
• the stiffener comprises a horizontal part disposed on the upper surface of the package substrate at the four sides of the package substrate and a vertical part extending downward from the horizontal part in a vertical direction perpendicular to the upper surface of the package substrate at four corners of the package substrate,
• the external board has a warpage shape where a center portion is disposed away from the package substrate in the first direction, and
• the vertical part protrudes by a first length in the vertical direction from a lower surface of the package substrate and contacts an upper surface of the external board in the first direction.