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US 2025/0096154 A1Published application
Package Substrates with Stiffener Interposers
AssigneeIntel Corporation
InventorsChin Mian CHOONG, Jiun Hann SIR, Poh Boon KHOO, Juha PAAVOLA
Life of this patent
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Abstract
The present disclosure is directed to a stiffener having a first lateral member and a vertical member that form a frame structure that encloses around a package substrate of a semiconductor package, and the vertical member having an upper end connected to the first lateral member and a lower end extending downward from the first lateral member for connecting to a printed circuit board.
Claims20
A device comprising:
- a first lateral member and a vertical member, wherein the first lateral member and the vertical member form a frame structure that encloses a package substrate of a semiconductor package;
- and
- the vertical member having an upper end connected to the first lateral member and a lower end extending downward from the first lateral member for connecting to a printed circuit board.
A method comprising:
- forming a stiffener, wherein the stiffener comprises a first lateral member and a vertical member;
- providing a package substrate for a semiconductor package, wherein the package substrate comprises a top surface, side surfaces, and a bottom surface;
- disposing at least one semiconductor die onto the top surface of the package substrate to form the semiconductor package;
- and
- disposing the stiffener on the package substrate, wherein the first lateral member is disposed on the top surface and the vertical member is disposed proximally to the side surfaces of the package substrate.
2 more elements
An electronic component comprising:
- a semiconductor package comprising a package substrate having a periphery;
- a plurality of solder balls attached to the package substrate;
- a frame structure enclosing the periphery of the package substrate and the plurality of solder balls;
- and
- a printed circuit board, wherein the frame structure and the plurality of solder balls are attached to the printed circuit board.
2 more elements
Dependencies are inferred from the claim text.