Back to results
US 2025/0096153 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChih-Hsien CHIU, Wen-Jung TSAI, Chien-Cheng LIN, Chun-Chong CHIEN, Shih-Shiung KUO
Life of this patent
Estimating the term…
Abstract
An electronic package and a manufacturing method thereof are provided, in which an electronic component is disposed on a substrate and covered with an encapsulation layer, and a frame body is embedded in the encapsulation layer and protrudes from the substrate. Therefore, the frame body can disperse thermal stress, thereby preventing warping from occurring to the electronic package.
Claims26
An electronic package, comprising:
- a substrate;
- an electronic component disposed on and electrically connected to the substrate;
- an encapsulation layer formed on the substrate and covering the electronic component;
- and
- a frame body embedded in the encapsulation layer and protruding from the substrate.
2 more elements
A method of manufacturing an electronic package, the method comprising:
- providing a substrate;
- disposing an electronic component and a frame body on the substrate, wherein the frame body is configured to protrude from the substrate;
- and
- forming an encapsulation layer on the substrate, wherein the encapsulation layer covers the electronic component and the frame body.
1 more element
Dependencies are inferred from the claim text.